Communications of the ACM
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How the “Frontier” Became the Slogan of Uncontrolled AI
Artificial intelligence (AI) has been billed as the next frontier of humanity: the newly available expanse whose exploration …
From insideHPC
n2 Group Acquires Managed Services Company X-ISS
Oxford, UK – 17 October 2024 – n2 Group, a computing technology investment company, announces the acquisition of high-performance computing (HPC) and AI specialists...
From insideHPC
IQM Selected for 2 Quantum Computers for Euro-Q-Exa Hybrid System at LRZ
Munich, 16th October 2024 – The EuroHPC Joint Undertaking (EuroHPC JU) has signed a purchase agreement with IQM Quantum Computers (IQM), a maker of superconducting...
From insideHPC
Women in High Performance Computing and ISC Group Extend Partnership for 2025
Bicester, UK—Women in High Performance Computing (WHPC) and ISC Group announced the continuation of their partnership in advance of ISC 2025, scheduled for June...
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Altair Announces Aerospace Collaboration with Motivo
TROY, Mich., October 15, 2024 – Altair (Nasdaq: ALTR) announced a collaboration with Motivo, a product engineering firm focused on translating forward-thinkingAltair...
From insideHPC
Dell AI Factory Offers New Cooling, High Density Compute and AI Storage
Round Rock, TEXAS – October 15, 2024: Dell Technologies (NYSE: DELL) introduced integrated rack-scalable systems, server, storage and data management innovations...
From insideHPC
HPE Launches ProLiant System Powered by AMD for AI
HOUSTON – October 10, 2024 – Hewlett Packard Enterprise (NYSE: HPE) today announced the HPE ProLiant Compute XD685 for complex AI model training tasks, poweredHPE...
From insideHPC
Dell Technologies Adds AMD-Powered PowerEdge Servers
San Francisco, Oct. 10, 2024 — Dell Technologies (NYSE: DELL) expanded it generative AI (GenAI) solutions portfolio with Dell AI Factory additions tailored forDell...
From insideHPC
HPE Announces Fanless Direct Liquid Cooling Systems Architecture
HOUSTON – Oct. 10, 2024 – Hewlett Packard Enterprise (NYSE: HPE) today announced what the company said is the industry’s first 100 percent fanless direct liquid...
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AMD Launches CPU, GPU and DPU Chips Aimed at Big AI
Today in San Francisco AMD announced updated versions of its chips portfolio and moved to position itself as an across-the-board provider of data center technology...
From insideHPC
HF Sinclair Launches Immersion Cooling Fluids
Oct. 9, 2024 — HF Sinclair’s Lubricants & Specialties business annoiunced a line of single-phase immersion cooling fluids. INNOVATE is a series of dielectric thermal...
From insideHPC
Airbus Selects Multiverse for Gesture Recognition Control Systems for Fighter Pilots
DONOSTIA-SAN SEBASTIÁN, SPAIN – October 9th, 2024 – Multiverse Computing, a quantum AI software company, today announced it will work with Airbus Defence and Space...
From insideHPC
Supermicro Introduces 3U Server for Edge AI
San Jose, October 8, 2024 – Supermicro announced a high-density infrastructure platform optimized for AI inferencing at the network edge. Supermicro’s system delivers...
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Foxconn Orders Blackwell-Powered 90 AI Exaflops Supercomputer
Nvidia and Taiwanese electronics manufacturer Foxconn are building what the companies said is Taiwan’s largest supercomputer. The system, to be housed at the Hon...
From insideHPC
Nov. 14 Deadlinefor 2 DOE ASCR Scientific Computing Review Panels
Oct. 7, 2024: The U.S. Department of Energy’s Advanced Scientific Computing Research (ASCR) program has announced that Thursday, Nov. 14 is the deadline for two...
From insideHPC
Nov. 11 Deadline: ASCR Announces 2025 Leadership Computing Challenge
Oct. 7 2024 — The U.S. Department of Energy’s ASCR Leadership Computing Challenge (ALCC) is an allocation program for projects of interest to DOE, with emphasis...
From insideHPC
HPC: Driving Cryptocurrency Growth and Changing Its Future
Behind the rapid expansion of cryptocurrencies in recent years are two often-overlooked technologies: blockchain and high-performance computing. Both play crucial...
From insideHPC
Amkor and TSMC Collaborate on Advanced Packaging in Arizona
TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging...
From insideHPC
Sandia: Molecular Dynamics Simulation Record Breakers Nominated for Gordon Bell Prize
Sandia National Laboratories announced today a new speed record in molecular dynamics simulation. A collaborative research team ran simulations using the Cerebras...
From insideHPC
Submer Secures $55.5M Round for Immersion Cooling
October 3, 2024 — Submer announced an investment round of $55.5 million USD, led by M&G, an investment company with £346.1 billion assets under management as of...
From insideHPC