acm-header
Sign In

Communications of the ACM

Blogroll


Refine your search:
dateMore Than a Year Ago
authorstaff
bg-corner

Intel Architecture Day: Details Revealed on Sapphire Rapids and ‘Powered on’ Ponte Vecchio
From insideHPC

Intel Architecture Day: Details Revealed on Sapphire Rapids and ‘Powered on’ Ponte Vecchio

Harried data center and HPC server market dominator Intel today unveiled what the company said is its biggest shifts in Intel architectures in a generation. The...

Baidu Announces Baidu Brain 7.0 and Production of 2nd Gen Kunlun AI Chip
From insideHPC

Baidu Announces Baidu Brain 7.0 and Production of 2nd Gen Kunlun AI Chip

BEIJING, Aug. 18, 2021 — Baidu today showcased its artificial intelligence technology with the launch of Baidu Brain 7.0, the start of mass production of its 2nd...

DOE Funds $6M to 5 Labs for Science Applications over 5G Networks
From insideHPC

DOE Funds $6M to 5 Labs for Science Applications over 5G Networks

The U.S. Department of Energy (DOE) today said it will provide $6 million in funding for five research and development projects to advance 5G wireless networking...

HPE CTO Sreekanti to Retire as Neri Announces new GreenLake Teams
From insideHPC

HPE CTO Sreekanti to Retire as Neri Announces new GreenLake Teams

Changes are afoot in the management ranks at HPE – starting with the departure of CTO and Head of Software Kumar Sreekanti, whom President/CEO Antonio Neri said...

Clemson Will Put HPC Knowledge to the Test at SC21
From insideHPC

Clemson Will Put HPC Knowledge to the Test at SC21

With support from Dell Technologies, a Clemson University student team prepares for a high performance computing competition at SC21. The SC21 international conference...

9th Annual MVAPICH User Group (MUG) to Meet Aug. 23-25
From insideHPC

9th Annual MVAPICH User Group (MUG) to Meet Aug. 23-25

The 9th Annual MVAPICH User Group (MUG) meeting will take place August 23-25, 2021 in Columbus, OH. The organizers said MUG meeting is an open forum for users,9th...

Applications Open for 2022 Better Scientific Software Fellowship Program
From insideHPC

Applications Open for 2022 Better Scientific Software Fellowship Program

Applications are now open for the BSSw Fellowship Program, which provides recognition and funding for leaders and advocates of high-quality scientific softwareApplications...

Dell, Xenon in $7M Deal with Pawsey Supercomputing Centre to Deploy 130PB of Multi-tier Storage
From insideHPC

Dell, Xenon in $7M Deal with Pawsey Supercomputing Centre to Deploy 130PB of Multi-tier Storage

Aug. 16, 2021 – Australia’s Pawsey Supercomputing Centre said it will become home to one of the largest research-focused object storage systems in the world, with...

Using WRF to Simulate Nuclear Cloud Rise at LLNL
From insideHPC

Using WRF to Simulate Nuclear Cloud Rise at LLNL

For decades, understanding the behavior of a nuclear mushroom cloud was done with careful analysis of observations made during the testing era. Old photos, outdated...

NVIDIA’s Jensen Huang to Receive Semiconductor Industry’s Noyce Award
From insideHPC

NVIDIA’s Jensen Huang to Receive Semiconductor Industry’s Noyce Award

WASHINGTON — Aug. 12, 2021 — The Semiconductor Industry Association (SIA) today announced Jensen Huang, founder and CEO of NVIDIA with a focus on building accelerated...

SDSC Part of New NSF Project Supporting Transboundary Aquifer Resiliency
From insideHPC

SDSC Part of New NSF Project Supporting Transboundary Aquifer Resiliency

August 11, 2021 — Transboundary aquifers, which are deep subsurface water sources shared by multiple countries, have long been a critical source of water for communities...

Oak Ridge Lab’s Simulation Tool Creates Digital Twin of Buildings
From insideHPC

Oak Ridge Lab’s Simulation Tool Creates Digital Twin of Buildings

August 11, 2021 — A new tool that simulates the energy profile of every building in America will give homeowners, utilities and companies a quick way to determine...

Phison Enters High Speed IC Market – Addresses Motherboard Compatibility Problems Caused by PCIe 5.0 High-Speed Interface
From insideHPC

Phison Enters High Speed IC Market – Addresses Motherboard Compatibility Problems Caused by PCIe 5.0 High-Speed Interface

San Jose, August 11, 2021 –Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered...

SDSC Team Awarded Funding for NSF GO FAIR Symposium
From insideHPC

SDSC Team Awarded Funding for NSF GO FAIR Symposium

Aug. 10, 2021 — The San Diego Supercomputer Center’s (SDSC) Research Data Services (RDS) Chief Strategist Melissa Cragin and Division Director Christine Kirkpatrick...

EdgeConneX and Opus Interactive Collaborate for Hybrid Multi-Cloud Solutions at the Edge
From insideHPC

EdgeConneX and Opus Interactive Collaborate for Hybrid Multi-Cloud Solutions at the Edge

HERNDON, Va., August 11, 2021 – EdgeConneX, the pioneer in global Hyperlocal to Hyperscale Data Center Solutions, today announces its partnership with Opus Interactive...

Univ. of Michigan Researchers Using TACC Frontera HPC for Space Weather Forecasting
From insideHPC

Univ. of Michigan Researchers Using TACC Frontera HPC for Space Weather Forecasting

“There are only two natural disasters that could impact the entire U.S.,” according to Gabor Toth, professor of Climate and Space Sciences and Engineering at the...

DOE Extends Deadline for Ernest Orlando Lawrence Award Call for Nominations
From insideHPC

DOE Extends Deadline for Ernest Orlando Lawrence Award Call for Nominations

Aug. 11, 2021 — The U.S. Department of Energy (DOE) has issued a call for nominations for the 2021 Ernest Orlando Lawrence Award, which is presented by the Secretary...

Cambridge Quantum Part of Team Claiming Blockchain Defense against Quantum Security Threats
From insideHPC

Cambridge Quantum Part of Team Claiming Blockchain Defense against Quantum Security Threats

UK-based Cambridge Quantum is part of a troika that has announced a defense against quantum computing-based security threats to blockchain networks. A project team...

LLNL Names Bradley Wallin to Lead Weapons and Complex Integration
From insideHPC

LLNL Names Bradley Wallin to Lead Weapons and Complex Integration

Aug. 10, 2021 — Bradley Wallin has been named Lawrence Livermore National Laboratory’s (LLNL’s) principal associate director (PAD) for Weapons and Complex Integration...

DOE to Fund $37M to Small Businesses for Climate, Energy and Scientific R&D
From insideHPC

DOE to Fund $37M to Small Businesses for Climate, Energy and Scientific R&D

The U.S. Department of Energy (DOE) today announced a plan to provide $37 million for small businesses pursuing climate and energy research and development (R&D)...
Sign In for Full Access
» Forgot Password? » Create an ACM Web Account