acm-header
Sign In

Communications of the ACM

Blogroll


Refine your search:
datePast Year
authorstaff
bg-corner

Hammerspace Unveils the Fastest File System in the World for Training Enterprise AI Models at Scale
From insideHPC

Hammerspace Unveils the Fastest File System in the World for Training Enterprise AI Models at Scale

[SPONSORED GUEST ARTICLE] Hammerspace, the company orchestrating the Next Data Cycle, unveiled the high-performance NAS architecture needed to address the requirements...

NTT and Red Hat Fuel AI Analysis at the Edge with IOWN Technologies
From insideHPC

NTT and Red Hat Fuel AI Analysis at the Edge with IOWN Technologies

MWC BARCELONA – February 26, 2024 — As part of the Innovative Optical and Wireless Network (IOWN) initiative, NTT Corporation (NTT) and Red Hat, Inc., in collaboration...

DOE: E4S for Extreme-Scale Science Now Supports Nvidia Grace and Grace Hopper GPUs
From insideHPC

DOE: E4S for Extreme-Scale Science Now Supports Nvidia Grace and Grace Hopper GPUs

E4S, the open source Extreme-Scale Scientific Software Stack for HPC-AI scientific applications, now incorporates AI/ML libraries and expands GPU support to include...

TSMC Opens JASM Chip Fab Subsidiary in Japan
From insideHPC

TSMC Opens JASM Chip Fab Subsidiary in Japan

KUMAMOTO, Japan, Feb. 24, 2024 – TSMC (TWSE: 2330, NYSE: TSM) held an opening ceremony for its majority-owned subsidiary Japan Advanced Semiconductor Manufacturing...

Micron Announces Volume Production of HBM3E
From insideHPC

Micron Announces Volume Production of HBM3E

BOISE, Idaho, Feb. 26, 2024 — Memory and storage company Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory...

Advanced Clustering Launches New ClusterVisor Edition
From insideHPC

Advanced Clustering Launches New ClusterVisor Edition

KANSAS CITY, MO. (Feb. 23, 2024) – ClusterVisor, a HPC cluster management software solution from Advanced Clustering, is now available with a new edition that includes...

Supermicro Expands Portfolio for 5G
From insideHPC

Supermicro Expands Portfolio for 5G

San Jose and Barcelona — February 26, 2024 – Supermicro, Inc. (NASDAQ: SMCI), a provider for AI, cloud, storage, and 5G/edge solutions, announced an expanded portfolio...

HPC News Bytes 20240226: Intel Foundry Bash, Nvidia Earnings and AI Inference, HPC in Space, ISC 2024
From insideHPC

HPC News Bytes 20240226: Intel Foundry Bash, Nvidia Earnings and AI Inference, HPC in Space, ISC 2024

A happy Monday of Leap Year Week to you! We offer a rapid run-through of the latest in HPC-AI, including: Intel Foundry bash, Gelsinger talks up the “Systems Foundry...

NCSA Aids Researchers with AI on Multiple Fronts
From insideHPC

NCSA Aids Researchers with AI on Multiple Fronts

NCSA is the caretaker and manager of the Delta supercomputer, but that means more than just making sure the machine is running. The Center recently worked withNCSA...

Charles Wuischpard Names Nvidia VP North America Latin America Sales
From insideHPC

Charles Wuischpard Names Nvidia VP North America Latin America Sales

HPC industry veteran Charles Wuischpard, formerly of Intel and silicon photonics startup Ayar Labs, announced recently on his LinkedIn page that he has joined Nvidia...

IonQ Achieves Ion-Photon Entanglement for Quantum Networks
From insideHPC

IonQ Achieves Ion-Photon Entanglement for Quantum Networks

COLLEGE PARK, MD – February 22, 2024 – Quantum computing company IonQ (NYSE: IONQ) today announced it has generated photons entangled with ions repeatedly and reproducibly...

Registration Is Open for ISC 2024 in Hamburg
From insideHPC

Registration Is Open for ISC 2024 in Hamburg

ISC 2024, the International Supercomputing Conference to be held at the Congress Center in Hamburg from Sunday, May 12 to Thursday, May 16, has announced that registration...

In-Memory Computing Could Be the Inference Breakthrough AI Needs
From insideHPC

In-Memory Computing Could Be the Inference Breakthrough AI Needs

[CONTRIBUTED THOUGHT LEADERSHIP ARTICLE] In-memory computing promises to revolutionize AI inference. Given the rapid adoption of generative AI, it makes senseIn...

Exascale: Bringing Engineering and Scientific Acceleration to Industry
From insideHPC

Exascale: Bringing Engineering and Scientific Acceleration to Industry

At SC23, held in Denver, Colorado, last November, members of ECP’s Industry and Agency Council, comprised of U.S. business executives, government agencies, andExascale...

NSF Announces $12M Funding Opportunity to Lower Latencies for Wireless Networks
From insideHPC

NSF Announces $12M Funding Opportunity to Lower Latencies for Wireless Networks

Feb. 212, 2024 — The U.S. National Science Foundation published a new funding opportunity designed to bring together innovators in wireless communications to develop...

Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration
From insideHPC

Cadence and Intel Foundry Partner on EMIB Packaging for Heterogeneous Integration

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect...

Arm Announces New Neoverse Compute Subsystems
From insideHPC

Arm Announces New Neoverse Compute Subsystems

Arm today announced two new Neoverse Compute Subsystems (CSS) built on new Neoverse IP for the purpose of “enabling the AI infrastructure on Arm,” according toArm...

Virtus Open AI-Ready Data Center in Buckinghamshire
From insideHPC

Virtus Open AI-Ready Data Center in Buckinghamshire

LONDON – 19 February, 2024] VIRTUS Data Centres, part of the ST Telemedia Global Data Centres Group, has announced plans for a new data centre campus that willVirtus...

Arcitecta Unveils Global Data Transfer Capabilities
From insideHPC

Arcitecta Unveils Global Data Transfer Capabilities

MELBOURNE & SYDNEY– February 19, 2024 – Arcitecta, a data management software company, announced enhancements to its Mediaflux Livewire offering that address the...

UCSD and CEA-Leti Paper: DC-DC Converter Unifies Power Switches on a Single Chip
From insideHPC

UCSD and CEA-Leti Paper: DC-DC Converter Unifies Power Switches on a Single Chip

SAN DIEGO and GRENOBLE, France – Feb. 20, 2024 – University of California San Diego and CEA-Leti scientists report they have developed a ground-breaking piezoelectric...
Sign In for Full Access
» Forgot Password? » Create an ACM Web Account