Communications of the ACM
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How the “Frontier” Became the Slogan of Uncontrolled AI
Artificial intelligence (AI) has been billed as the next frontier of humanity: the newly available expanse whose exploration …
From insideHPC
ISC 2022 Joint Keynote to Be Delivered by NVIDIA and BMW on Digital Twins and HPC
Hamburg, Germany, March 22, 2022 – The ISC 2022 HPC conference organizers have announced that the opening keynote, a joint presentation on digital twins simulation...
From insideHPC
CEA-Leti Scientist Elisa Vianello Receives €3 Million ERC Grant for Nanoscale Memories
GRENOBLE, France – March 22, 2021 – CEA-Leti today announced that Elisa Vianello, senior scientist and Edge AI program coordinator, has received a €3 million grant...
From insideHPC
Supermicro Launches SuperBlade, Twin and Ultra Server Families Powered by 3rd Gen AMD EPYC
SAN JOSE, March 21, 2022 –Super Micro Computer, Inc. (SMCI), a high-performance computing, storage, networking solutions and green computing technology company...
From insideHPC
IonQ Aria Coming to Microsoft’s Azure Quantum Platform
COLLEGE PARK, Md. – March 21, 2022 – Quantum computing company IonQ today announced it has signed an agreement with Microsoft to bring IonQ Aria, the company’sIonQ...
From insideHPC
Ansys Collaborates with Microsoft on Chips, Simulation and Cloud Computing for HPC
PITTSBURGH, March 21, 2022 – Ansys (NASDAQ: ANSS) today said its customers will have automatic cloud access to new 3rd Gen AMD EPYC processors with AMD 3D V-Cache...
From insideHPC
GIGABYTE Announces Servers with AMD EPYC Processors for the Data Center
March 21st 2022 – GIGABYTE Technology, (TWSE: 2376), a maker of high-performance servers and workstations, today announced enterprise products to support the launch...
From insideHPC
TYAN Announces Servers with 3rd Gen AMD EPYC Chips
Newark, Calif. – March 21, 2022 – TYAN, server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today announced availability...
From insideHPC
AMD Announces GA of 3rd Gen AMD EPYCs with 3D V-Cache for Technical Computing
Seeking to continue on its market share eating roll in the data center server chips sector, AMD announced GA of what the company said is the world’s first dataAMD...
From insideHPC
Truman and Hruby 2022 Fellows at Sandia Explore Their Possibilities
ALBUQUERQUE, N.M. — Postdoctoral researchers who are designated Truman and Hruby fellows experience Sandia National Laboratories differently from their peers. Appointees...
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DOE: $50M for Fusion Energy Research Opportunities
The U.S. Department of Energy (DOE) announced a plan to provide up to $50 million to support U.S. scientists conducting experimental research in fusion energy science...
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Quantum Announces Smart Video Surveillance Servers
SAN JOSE, March 15, 2022 — Quantum Corporation (NASDAQ: QMCO), the leader in solutions for video and unstructured data, today announced the Unified Surveillance...
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NEC: First Unit Cell for Scaling up to a Fully-connected Quantum Annealing Architecture
Tokyo, March 17, 2022 – NEC Corporation (NEC; TSE: 6701) has developed the world’s first LHZ scheme (*1) unit cell facilitating scaling up to a fully-connectedNEC...
From insideHPC
Edge. Retail AI. Digital Twinning. Oh My!
[SPONSORED POST] Attending NVIDIA’s GTC? While you’re there, join Lenovo - Diamond sponsor - to connect, learn, and get inspired by some of the world’s brightest...
From insideHPC
Why HPC Clusters Require Ultra-Low Latency Network Monitoring
High performance computing (HPC) requires an extremely high-powered network with ultra-low latency to move large files between HPC nodes quickly. IT and network...
From insideHPC
Cerebras and nference Launch NLP Collaboration
SUNNYVALE, Calif. – High performance AI compute company Cerebras Systems and nference, an AI-driven health technology company, today announced a collaboration to...
From insideHPC
GRC Launches Trial Program for Data Center Liquid Immersion Cooling
AUSTIN,TEXAS –March 15, 2022 — Immersion cooling company GRC (Green Revolution Cooling) today announced the launch of its Immersion Cooling Pilot Program, a “Try...
From insideHPC
DevOps Institute Announces 2022 SKILup Festival
LEHIGH ACRES, Fla. – March 15, 2021 – DevOps Institute, a professional member association for advancing DevOps, announced early bird registration for its firstDevOps...
From insideHPC
Hailo and CVEDIA Team for Thermal Edge AI
Tel Aviv and London, March 15th, 2022 – AI chipmaker Hailo has announced a partnership with edge computer vision company CVEDIA to launch thermal edge AI solutions...
From insideHPC
BullSequana XH3000, Delivering the Full Exascale Solution
In this sponsored post, Jean-Pierre Panziera – High Performance Computing CTO, Atos, discusses how the BullSequana XH3000 which supports a large spectrum of hardware...
From insideHPC