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Ramon.Space Raises $17.5M for Supercomputing in Space
From insideHPC

Ramon.Space Raises $17.5M for Supercomputing in Space

PALO ALTO, Calif. and YOKNEAM, Israel, May 25, 2021 — Ramon.Space, developer of space computing solutions, has raised $17.5M in Series A funding. The round includes...

Kao Data Is NVIDIA DGX-Ready
From insideHPC

Kao Data Is NVIDIA DGX-Ready

London, May 25, 2021 — Kao Data, developer and operator of carrier neutral data centres for high performance colocation, has today announced it has become NVIDIA...

June 2 ENERXICO Webinar: Energy Subsurface Exploration with HPC
From insideHPC

June 2 ENERXICO Webinar: Energy Subsurface Exploration with HPC

The ENERXICO project, a Europe-Mexico collaboration to develop performance simulation tools requiring exascale HPC and data intensive algorithms for energy sources...

ALCF Data Science Program Awards 4 Projects
From insideHPC

ALCF Data Science Program Awards 4 Projects

The Argonne Leadership Computing Facility (ALCF) recently awarded computing time and resources to three new projects and one renewed project for 2021-2022, through...

UL Joins Open Compute Project to Further Enable Data Center and Enterprise System Designs
From insideHPC

UL Joins Open Compute Project to Further Enable Data Center and Enterprise System Designs

Northbrook, Ill., May 24, 2021 — UL, the global safety science leader, today announced that it has joined the Open Compute Project (OCP). UL joined the organization...

insideHPC Guide to How Expert Design Engineering and a Building Block Approach Can Give You a Perfectly Tailored AI, ML or HPC Environment – Part 3
From insideHPC

insideHPC Guide to How Expert Design Engineering and a Building Block Approach Can Give You a Perfectly Tailored AI, ML or HPC Environment – Part 3

In this insideHPC technology guide, “How Expert Design Engineering and a Building Block Approach Can Give You a Perfectly Tailored AI, ML or HPC Environment,”we...

OLCF Releases Storage Specs for Frontier Exascale
From insideHPC

OLCF Releases Storage Specs for Frontier Exascale

A newly enhanced I/O subsystem will support the nation’s first exascale supercomputer, the HPE Cray Frontier system, and the Oak Ridge Leadership Computing Facility...

Purdue University Seeing New Opportunities for Innovation with Cloud Technology Using Azure’s AMD EPYC™ Processor-based HBv3 Instances
From insideHPC

Purdue University Seeing New Opportunities for Innovation with Cloud Technology Using Azure’s AMD EPYC™ Processor-based HBv3 Instances

In this sponsored article, Preston Smith, Director of Research Services and Support at Purdue University, discusses how Purdue University's community cluster program...

International Advanced Research Workshop on HPC Returns to Cetraro, Italy July 26-30
From insideHPC

International Advanced Research Workshop on HPC Returns to Cetraro, Italy July 26-30

May 20, 2021 – The International Advanced Research Workshop on HPC – State of the Art, Emerging Disruptive Innovations and Future Scenarios – which had to be cancelled...

Teratec Forum June 22: Europe on Way to ‘Hybrid Qomputing’
From insideHPC

Teratec Forum June 22: Europe on Way to ‘Hybrid Qomputing’

This Teratec workshop will demonstrate that the next step in high performance computing is the introduction of quantum accelerators (quantum processing units, in...

Supermicro Introduces Liquid Cooling Solutions for Demanding Systems
From insideHPC

Supermicro Introduces Liquid Cooling Solutions for Demanding Systems

San Jose, May 20, 2021 — Super Micro Computer, Inc. (Nasdaq: SMCI), maker of enterprise computing, storage, networking and green computing technology solutions,...

Summit Supercomputer Helps Crack Code to Signature Superconductor ‘Kink’
From insideHPC

Summit Supercomputer Helps Crack Code to Signature Superconductor ‘Kink’

May 19, 2021 — Scientists have long been trying to understand the behavior of superconductors, materials that have zero electrical resistance when they reach sufficiently...

Remembering Rich Brueckner
From insideHPC

Remembering Rich Brueckner

Today we observe a sad, one-year commemoration. It was a year ago that Rich Brueckner, the long-time editor-in-chief of insideHPC and one of the most popular and...

Avery Design Systems and Rambus Extend Memory Model and PCIe VIP Collaboration
From insideHPC

Avery Design Systems and Rambus Extend Memory Model and PCIe VIP Collaboration

Tewksbury, MA. and San Jose – May 19, 2021 – Avery Design Systems, maker of functional verification solutions, and Rambus Inc. (NASDAQ: RMBS), a provider of chips...

An Update on Aurora Exascale Readiness at Argonne
From insideHPC

An Update on Aurora Exascale Readiness at Argonne

Argonne Science Writer Nils Heinohen wrote this article on the work of JaeHyuk Kwack, computational scientist at the Argonne Leadership Computing Facility (ALCF)...

Asian Student Cluster Competition: Brutally Difficult
From insideHPC

Asian Student Cluster Competition: Brutally Difficult

By Dan Olds The Asian Student Cluster competitions held by the Asian Supercomputer Community (ASC) have always had a reputation of being particularly demandingAsian...

LogicPlum Publishes AI Food Production Article in Agricultural Research & Technology Journal
From insideHPC

LogicPlum Publishes AI Food Production Article in Agricultural Research & Technology Journal

FRANKLIN, Tenn., May 19, 2021 — LogicPlum (https://logicplum.com/) announced it had published research in “Agricultural Research & Technology” that provides information...

Vayyar Claims 1st Single Chip 4D Imaging Radar Sensor ‘XRR’ Covering Distances 0-300M
From insideHPC

Vayyar Claims 1st Single Chip 4D Imaging Radar Sensor ‘XRR’ Covering Distances 0-300M

TEL AVIV – 19 May, 2021 – Vayyar Imaging, a 4D imaging radar company, has launched what it said is the world’s first multi-range “XRR” chip, a single RFIC withVayyar...

Let’s Talk Exascale – ECP Director Kothe Provides Project Update
From insideHPC

Let’s Talk Exascale – ECP Director Kothe Provides Project Update

In this May 2021 interview, ECP Director Doug Kothe provides an update on the effort to deliver a capable and sustainable exascale computing ecosystem for the nation...

GRC Releases New Data Center Liquid Immersion Cooling, Claims PUE Yield of <1.03
From insideHPC

GRC Releases New Data Center Liquid Immersion Cooling, Claims PUE Yield of <1.03

AUSTIN, TX – May 18 , 2021 – GRC (Green Revolution Cooling), maker of single-phase liquid immersion cooling for data centers, today announced the latest redesign...
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