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PCI-SIG Announces CopprLink Cable Specifications for PCIe 5.0 and 6.0
From insideHPC

PCI-SIG Announces CopprLink Cable Specifications for PCIe 5.0 and 6.0

BEAVERTON, Ore. – May 1, 2024 – PCI-SIG, the organization responsible for the widely adopted PCI Express (PCIe) standard, today announced the release of the CopprLink...

Quantum Corp. Announces Subscription Model
From insideHPC

Quantum Corp. Announces Subscription Model

SAN JOSE, Calif., May 1, 2024 — Data Management solutions company Quantum Corporation (NASDAQ: QMCO) today announced the availability of Quantum GO, a subscription...

Durham University Cosmologists, DiRAC and Dell Improve HPC Energy Efficiency without Sacrificing Performance
From insideHPC

Durham University Cosmologists, DiRAC and Dell Improve HPC Energy Efficiency without Sacrificing Performance

[SPONSORED GUEST ARTICLE]  Since the beginning of human existence, people have looked into the night sky and wondered how the universe began. Cosmologists using...

IEEE Electronic Components and Technology Conference, May 28-31 in Denver
From insideHPC

IEEE Electronic Components and Technology Conference, May 28-31 in Denver

DENVER (April 30, 2024) – The forum for microelectronics packaging and component science and technology, the 74th annual IEEE Electronic Components and Technology...

AI Developer CUBOX Developing GenAI Models with HPE Cray Supercomputer
From insideHPC

AI Developer CUBOX Developing GenAI Models with HPE Cray Supercomputer

SEOUL, South Korea – April 30, 2024 – Hewlett Packard Enterprise (NYSE: HPE) today announced that CUBOX, an AI facial and image recognition company in South Korea...

DOE Annunces Actions in Support of White House AI Executive Orders
From insideHPC

DOE Annunces Actions in Support of White House AI Executive Orders

WASHINGTON, D.C. — The U.S. Department of Energy (DOE) today announced a series of actions in support of the Executive Order on the Safe, Secure, and Trustworthy...

Intersect360 Sizes HPC-AI Market at $85.7B, Up 62% Driven by Hyperscalers
From insideHPC

Intersect360 Sizes HPC-AI Market at $85.7B, Up 62% Driven by Hyperscalers

Analyst firm Intersect360 Research has released its annual report placing the worldwide market for scalable computing infrastructure for HPC and AI at $85.7 billion...

HPC News Bytes 20240429: Exorbitant AI Infra-Tech, Advanced Chips in China, Neuromorphic HPC and an AI Bubble?
From insideHPC

HPC News Bytes 20240429: Exorbitant AI Infra-Tech, Advanced Chips in China, Neuromorphic HPC and an AI Bubble?

A good mid-spring morn to you! You’re invited to join Shahin and Doug on a jaunt (6:04) through recent HPC-AI developments, including: AI infra-tech’s booming costs...

IBM in $137M Semiconductor Agreement with Canada
From insideHPC

IBM in $137M Semiconductor Agreement with Canada

BROMONT, QC, April 26, 2024 — IBM, the government of Canada and the government of Quebec today announced agreements to develop the assembly, testing and packaging...

Join the AMD HPC User Forum for an HPC Sync at ISC 2024
From insideHPC

Join the AMD HPC User Forum for an HPC Sync at ISC 2024

[SPONSORED GUEST POST] The AMD HPC User Forum is holding a technical workshop prior to ISC High Performance on Sunday, May 12th, 2024, from 8:00AM – 12:00PM in...

Nvidia AI Enterprise Available on Oracle US Government Cloud
From insideHPC

Nvidia AI Enterprise Available on Oracle US Government Cloud

April 25, 2024 — Oracle today announced that Nvidia AI Enterprise on Oracle Cloud Infrastructure Supercluster is now available in the Oracle U.S. Government Cloud...

Diane Bryant Named to Celestial AI Board
From insideHPC

Diane Bryant Named to Celestial AI Board

SANTA CLARA, CA – April 29, 2024 – Optical interconnect company Celestial AI today announced the appointment of Diane Bryant to the company’s board of directors...

Duke Researcher Dr. Amanda Randles Wins ACM Prize in Computing for Medical Diagnostics
From insideHPC

Duke Researcher Dr. Amanda Randles Wins ACM Prize in Computing for Medical Diagnostics

The Association for Computing Machinery, named Amanda Randles of Duke University the recipient of the ACM Prize in Computing for groundbreaking contributions to...

Jump Trading Selects DDN for AI Quantitative Trading
From insideHPC

Jump Trading Selects DDN for AI Quantitative Trading

CHATSWORTH, Calif. – April 24, 2024 – Data management company DDN has announced that quantitative trading firm Jump Trading has selected DDN for its high-performance...

NVIDIA to Acquire Run:ai GPU Orchestration Software Vendor
From insideHPC

NVIDIA to Acquire Run:ai GPU Orchestration Software Vendor

Nvidia today announced it has agreed to acquire Run:ai, a Kubernetes-based workload management and orchestration software provider. Terms were not released butNVIDIA...

Lenovo Launches AI Servers with AMD MI300X GPUs
From insideHPC

Lenovo Launches AI Servers with AMD MI300X GPUs

Lenovo today announced AI-centric infrastructure systems in collaboration with AMD, including the ThinkSystem SR685a V3 8GPU server (pictured here), designed for...

CINECA Selects E4 Computer with Dell and Vast for Galileo 100 HPC Upgrade
From insideHPC

CINECA Selects E4 Computer with Dell and Vast for Galileo 100 HPC Upgrade

April 23, 2024 — E4 Computer Engineering has won the contract to upgrade Galileo 100, CINECA Interuniversity Consortium’s supercomputer and Tier-1 cloud systemCINECA...

Quantum Corp. Announces DXi All-Flash Backup Appliances
From insideHPC

Quantum Corp. Announces DXi All-Flash Backup Appliances

SAN JOSE, April 23, 2024 — Data management and storage company Quantum Corporation (NASDAQ: QMCO)  today announced DXi T-Series all-flash backup appliances to accelerate...

HPC MARKET UPDATE PRE-ISC24
From insideHPC

HPC MARKET UPDATE PRE-ISC24

  Registration is now open for Hyperion Research’s annual HPC market update (virtual) session held immediately prior to the ISC24 conference. The annual event is...

SK hynix Partners with TSMC  on HBM
From insideHPC

SK hynix Partners with TSMC on HBM

Seoul, April 19, 2024 – Memory company SK hynix Inc. announced today a memorandum of understanding with TSMC to produce next-generation HBM and enhance logic and...
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