This work investigates and quantifies the costs and benefits of using multi-chip-modules with fine-grained chiplets for deep learning inference, an application...Yakun Sophia Shao, Jason Cemons, Rangharajan Venkatesan, Brian Zimmer, Matthew Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, Nathaniel Pinckney, Priyanka Raina, Stephen G. Tell, Yanqing Zhang, William J. Dally, Joel Emer, C. Thomas Gray, Brucek Khailany, Stephen W. Keckler From Communications of the ACM | June 2021
This paper evaluates the use of three-dimensional integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between...Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory Chen, Dennis Sylvester, David Blaauw, Trevor Mudge From Communications of the ACM | November 2013
