Communications of the ACM
Sandia's 'cooler' Technology Offers Fundamental Breakthrough in Heat Transfer For Microelectronics, Other Cooling Applications
Sandia's Jeff Koplow makes an adjustment to a prototype of his Air Bearing Heat Exchanger technology, known as the "Sandia Cooler."
Credit: Dino Vournas / Sandia
Sandia National Laboratories researchers have developed the Sandia Cooler, air-cooling technology that has the potential to greatly improve the heat-transfer capabilities of computing and microelectronics devices.
The researchers say that Sandia Cooler technology can significantly reduce the energy needed to cool the processor chips in data centers and large-scale computing environments. In the Sandia Cooler, heat is transferred across a gap that is much narrower than in conventional systems. This smaller gap allows for the improved cooling performance within a much smaller package.
In testing, the Sandia Cooler was used in a proof-of-concept prototype for computer central-processing units and the system has shown potential for personal computer applications as well, according to Sandia's Jeff Koplow. The Sandia Cooler also can be applied to other systems in which thermal management and energy efficiency are important, such as heating, ventilation, and air conditioning.
From Sandia National Laboratories
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