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DARPA Wants Teeny-Tiny Fluids to Cool Down Next-Gen Microchips
Conceptual image for 3D stacked microchips by IBM that could possibly lead to a chip 1,000 times more powerful than whats in use today. But is it too hot?
Credit: IBM
The Pentagon's mad scientists have concocted a plan to keep the miniature, stacked brains of tomorrow's advanced computers cool enough to power next-gen technological advances.
From Wired
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