Don David at the Cooperative Institute for Research in Environmental Sciences (CIRES) in Boulder, CO, along with colleagues at the U.S. National Institute of Standards and Technology (NIST), have described a process for producing an ultrathin layer of rhenium sandwiched between gold layers, each measuring 1/1000th the diameter of a human hair, that can superconduct at critical temperatures higher than 6 degrees Kelvin (-449 degrees Fahrenheit).
The electroplated rhenium is ideal for use in circuit boards for ultrafast, next-generation computing applications: superconducting at higher, easier-to-achieve critical temperatures; easy to work with mechanically; non-toxic, and having a high melting point.
This follows last year's discovery of the combination by CIRES and NIST researchers. The achievement represents a major step forward in the creation of the high-performance, superconducting computers of the future.
From Cooperative Institute for Research in Environmental Sciences
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