Communications of the ACM
Engineers Build LEGO-Like AI Chip
The reconfigurable AI chip is comprised of alternating layers of sensing and processing elements that can communicate with each other.
Credit; Jeehwan Kim et al, MIT News
An international team led by researchers at the Massachusetts Institute of Technology has developed an artificial intelligence chip that is stackable and reconfigurable, similar to LEGO bricks.
The chip features alternating layers of sensing and processing elements and uses light-emitting diodes instead of physical wires to enable communication between layers.
Said MIT's Jihoon Kang, "You can add as many computing layers and sensors as you want, such as for light, pressure, and even smell."
The new design pairs image sensors with the team's previously developed artificial synapse arrays, known as "memristors."
The chip was configured to perform basic image-recognition tasks and classified clear images correctly.
After swapping out the chip's processing layer with a better "denoising" processor, it was able to identify blurry images accurately.
Said MIT's Min-Kyu Song, "We showed stackability, replaceability, and the ability to insert a new function into the chip."
From MIT News
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