Communications of the ACM
Siemens Automates Design Process for Testing Chips with Advanced Packaging
Siemens' Tessent Multi-die software helps customers speed and simplify critical design-for-test tasks for next-generation integrated circuits based on 2.5D and 3D architectures.
Credit: Siemens Digital Industries Software
Siemens Digital Industries Software has rolled out a new software system that automates the design process for testing chips with several layers of silicon tiles.
The Tessent Multi-die software addresses the trend of chip makers stacking several tiles to increase computing power and combine different technologies to boost performance.
A port for testing must be designed into the chips prior to manufacturing.
Siemens' Ankur Gupta said that prior to the new software, the company worked with customers on a case-by-case basis when testing chips made with advanced packaging.
Gupta said advanced packaging, also called 2.5- and three-dimensional packaging, will get a boost as a result of the simplified testing process.
Said Gupta, "What we are doing now is taking all of those learnings and automating the solution, making it available general purpose for everybody to use."
From Reuters
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