Communications of the ACM
Chip Makers Stack 'Chiplets' Like Lego Blocks to Drive AI
With the new chiplet packaging, engineers have found ways to bolt together pre-existing chips.
Credit: Nvidia
Chip makers are stacking pre-existing chips like toy building blocks to speed the development of more powerful chips.
IBM’s Darío Gil said, "A huge part of the future of semiconductors is packaging and chiplets. It's just much more powerful than having to design a massive chip from scratch."
A coalition of chip makers formed last year aims to develop standards for chiplet design.
Chiplet technology has gained popularity among companies looking to quickly design chips for use in artificial intelligence technology, but chiplet production costs remain high, so chiplet designs are viewed as more suitable for higher-end products, and combining several less-advanced chips is seen as a more cost-effective way to boost performance.
From The Wall Street Journal
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