Communications of the ACM
2D Material Reshapes 3D Electronics for Hardware
The system stacks different functional layers, including AI computing layers, signal-processing layers and a sensory layer, and integrates them into an AI processor.
Credit: Sang-Hoon Bae
An international team that included researchers from Washington University in St. Louis (WashU) developed a monolithic three-dimensional (3D) integrated chip comprised of layered two-dimensional (2D) materials, which could allow numerous functions to be fully integrated into a single chip.
Each of the chip's six atomically thin 2D layers have their own function.
Tightly packing the processing layers to achieve dense interlayer connectivity allows for substantial reductions in processing time, power consumption, latency, and footprint.
Said WashU's Sang-Hoon Bae, "Monolithic 3D integration has the potential to reshape the entire electronics and computing industry by enabling the development of more compact, powerful, and energy-efficient devices," with potential applications in autonomous vehicles, medical diagnostics, and datacenters, among others.
From The Source (Washington University in St. Louis)
View Full Article
Abstracts Copyright © 2023 SmithBucklin, Washington, D.C., USA
No entries found