Communications of the ACM
Cmu, Intel Collaborate to Improve Energy Costs and Efficiency in Chip Making
Researchers at Intel and Carnegie Mellon University (CMU) have developed a new class of materials called solder magnetic nanocomposites, which could help streamline the process of computer electronic packaging.
The researchers have created a tool that uses radio frequency coils to heat specially designed magnetic particles. "By varying the concentration and composition of these magnetic particles we can control the time it takes to heat them, which ultimately helps improve the speed of processing them, and potentially lowers the cost," says CMU professor Michael McHenry.
McHenry and Intel's Raja Swaminathan also improved the electrical interconnects during the packaging process. "There are many possibilities for this process throughout a variety of industry sectors, including the semiconductor sector, aerospace, and data storage industry," McHenry says.
From Carnegie Mellon News
View Full Article
Abstracts Copyright © 2010 Information Inc., Bethesda, Maryland, USA 
No entries found