Communications of the ACM
Research Archive
The Research archive provides access to all Research articles published in past issues of Communications of the ACM.
January 2014
From Communications of the ACM
Technical Perspective: Silicon Stress
Moore's Law has been the mainstay of semiconductor electronics since the invention of the transistor and its application to the integrated circuit. Implicit in this evolution is the assumption that we can print these circuits…
From Communications of the ACM
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization For 3D IC
Three-dimensional integrated circuit (3D IC) with through-silicon-via (TSV) is believed to offer new levels of efficiency, power, performance, and form-factor advantages over the conventional 2D IC.