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The Research archive provides access to all Research articles published in past issues of Communications of the ACM.

November 2013


From Communications of the ACM

Technical Perspective: Centip3De Demonstrates More Than Moore...

Exponentially increasing transistor integration also demands more interconnections, which have started hitting fundamental limits. The Centip3De design demonstrates two concepts to address this challenge: near-threshold computing…


From Communications of the ACM

Centip3De: A Many-Core Prototype Exploring 3D Integration and Near-Threshold Computing

Centip3De

This paper evaluates the use of three-dimensional integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between them using through-silicon vias.